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ECSE 524 Interconnects and Signal Integrity (3 unit茅s)

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Nota : Ceci est la version 2021鈥�2022 de l'annuaire 茅lectronique. Veuillez mettre 脿 jour l'ann茅e dans la barre d'adresse de votre navigateur pour une version plus r茅cente de cette page, ou .

Offered by: G茅nie 茅lectr. et informatique (G茅nie et l'architecture)

Vue d'ensemble

G茅nie 茅lectrique : Interconnect structures, signal integrity issues: reflection, crosstalk, noise, electromagnetic interference, Lossy transmission lines, RLGC matrix representations, wave propagation in multilayered substrates, periodically loaded lines, Floquet's theorem, power distribution network, simultaneous switching noise, packaging structures, chip interconnection technologies, substrate integrated waveguides, methods for experimental characterization of interconnects, signal integrity CAD tools.

Terms: This course is not scheduled for the 2021-2022 academic year.

Instructors: There are no professors associated with this course for the 2021-2022 academic year.

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