Vue d'ensemble
G茅nie 茅lectrique : Discussion of high performance heterogeneous integration systems. Introduction to key design challenges, including interconnect, power delivery, synchronization, and testing, with respect to heterogeneous systems. Analysis of state-of-the-art integration platforms, such as three-dimensional integrated circuits, wafer-scale integration, and flexible substrates with respect to applications of interest. System-level perspective of the integration hierarchy (i.e., integrated circuit, package, and board).
Terms: This course is not scheduled for the 2024-2025 academic year.
Instructors: There are no professors associated with this course for the 2024-2025 academic year.
Prerequisites: ECSE 335 or permission of instructor.
